IPC-A-610 is the most widely used electronics assembly acceptance document. Updated with participants from 17 countries providing input and expertise, this document brings the latest acceptance criteria for Class 1, 2, and 3 electronic assemblies.
See the standard below for certification course content
Module 1 introduces the student to the IPC-A-610 document and addresses IPC-published policies and procedures for CIS understanding of certification requirements.
This module addresses the IPC-A-610 foreword, scope, purpose and product classifications. It includes terms and definitions, inspection methodology, magnification and lighting, applicable documents, product handling and EOS/ESD requirements.
Module 3 focuses on physical damage to, contamination, ESD/EOS damage, and post solder handling of electronic assemblies. It addresses mechanical installation of heat sinks, threaded fasteners, connector and press fit pins, and wire bundle securing and routing.
Module 4 addresses acceptability requirements for all types of soldered connections (SMT, terminals, through-hole etc.). These requirements apply irrespective of the soldering method used. Accept/reject criteria for common tin/lead and lead-free soldering anomalies are specified, including exposed metal, cold solder, nonwetting/dewetting, excess solder, disturbed solder, fractured solder, and solder projections.
This module addresses terminal connections between wires and component leads, and terminals. It includes swaged hardware, wire insulation damage and clearance, wire/strand damage, tinning requirements, and stress relief. Terminals include turrets, bifurcated terminals, slotted terminals, pierced terminals, hooks, and gold cups.
Module 6 includes hardware, adhesive, forming, mounting termination and soldering criteria for through-hole components. It identifies lead installation, protrusion, and solder coverage for both supported and unsupported holes. It also addresses routing, staking, and attachment of jumper wires on both SMT and through-hole terminations. Minimum passing score on an open book exam is 70%.
Module 7 covers acceptability requirements for surface mount assemblies. This includes staking adhesive and its application. SMT connection criteria are specified for surface mounted chips, MELFs, castellated terminations, gull wing and J-leads, surface mount arrays, and jumper wires.
This module addresses component damage. Included are examples of loss of metallization on SMT chip resistors, and component damage to leaded/leadless devices, connectors, relays, transformers, connectors, and connector/press fit pins. It also includes laminate and conductor/land defect conditions, and laminate marking, cleanliness, and coating variations.
Module 9 specifies requirements for Solderless Wrap. It includes criteria for number of turns and turn spacing, wire dress/slack, and wire dress strain/stress relief.