IPC J-STD-001G

 

IPC J-STD-001G JOINT INDUSTRY STANDARD - Requirements For Soldered Electrical & Electronic Assemblies

IPC J-STD-001G is also modularized to provide company flexibility in training CIS candidates. Topics include electronic assembly definitions, materials and equipment, hand soldering and assembly of through-hole and SMT assemblies, wires and terminals. Module 1 is a prerequisite to remaining modules. Modules 2 through 6 are optional and may be selected by the client for inclusion in the course. Each is certified separately. An open book exam is included for each module. A passing score of 70 percent is required for each. Students who successfully complete the course will receive an IPC J-STD-001G CIS Certificate of Training indicating each module successfully completed. This certification is valid for 24 months. Recertification includes review of the J-STD-001G document, written tests, and demonstration of soldering proficiency. To maximize student learning we limit skills training classes to 10 students.

 

Module 1: J-STD-001G Overview (Mandatory)

Module 1 includes an introduction to the IPC Policies and Procedures, the J-001G Standard, and outlines content of additional modules. Elements include Instructor lecture, material review, and open book written exam.

 

Module 2: Wires and Terminals (Optional)

Module 2 defines requirements for assembly of wires and terminal connections. It consists of Instructor lecture and Instructor demonstration of wire tinning and wire soldering to J-hook, turret, pierced, bifurcated, and cup terminals. Students practice each of these assembly techniques to demonstrate soldering proficiency in soldering terminal connections. An open-book exam is also included.

 

Module 3: Through-Hole Technology (Optional)

This module addresses assembly requirements for Through-Hole terminations. It includes Instructor lecture, review of related J-STD topics, and Instructor demonstration of Through-Hole component preparation and soldering to a PCB. Students practice each of these soldering techniques and demonstrate soldering proficiency in soldering several types of Through-Hole components onto a PCB.

 

Module 4: Surface Mount Technology (Optional)

This module addresses assembly requirements for Surface Mount terminations. It includes Instructor lecture, review of related J-STD topics, and instructor demonstration of SMT component preparation and soldering to a PCB. Students practice each of these assembly techniques to demonstrate soldering proficiency in soldering several types of SMT components onto a PCB.

 

Module 5: Inspection Methodology (Optional)

Module 5 introduces requirements for Inspection Methodology for soldered assemblies. Topics also provide an introduction to Process Control. It includes Instructor lecture, review of inspection-related topics, and an inspection skills lab. Each student inspects soldered assemblies with known defects and documents these inspection results.

 

Module 6: IPC J-STD-001G Space Addendum (Optional)

Module 6, Space Applications Electronic Hardware Addendum to J-STD-001G, is a 1-day course that identifies requirements to be used in addition to, or in lieu of, those published in J-STD-001G. Its goal is to ensure reliability of electronic assemblies in military and space-related applications.