IPC CIS Certification Training
IPC has issued several industry-consensus standards for the electronics industry. Together, these standards provide a comprehensive information resource, allowing companies process flexibility in implementation. These include:
As an IPC-Certified Trainer (CIT), AEIC is pleased to offer IPC Certified Specialist (CIS) certification and recertification training for each of these standards. These classes may be held either at the client facility or in convenient Consortium locations. These Consortium locations include Manchester NH, Burlington MA, Springfield MA, Danbury CT, Long Island NY, and Morristown NJ.
Select a standard below for certification course content.
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IPC-610F CIS Certification
IPC-610F titled “Acceptability of Electronic Assemblies” is the industry inspection standard for electronic assembly. In its latest revision, IPC-610F, content has been modularized for flexibility in company inspection training. Modules 1 and 2 are mandatory for CIS certification, while the remaining modules (3 through 9) are optional to reflect specific training needs of the client company. An open-book exam is included for each module. Minimum passing score for each module is 70 percent. Upon completing the course, the CIS receives an IPC-610 CIS Certificate of Training identifying each module successfully completed. This certification is valid for 24 months. Recertification includes review of the IPC-610 document and retesting.
- Module 1: Introduction (Mandatory)
- Module 2: Applicable Documents and Handling (Mandatory)
- Module 3: Hardware Installation (Optional)
- Module 4: Soldering (Optional)
- Module 5: Terminal Connections (Requires prior Module 4 – Optional)
- Module 6: Through-Hole Technology (Optional)
- Module 7: Surface Mount (SMT) Assemblies (Requires prior Modules 4 and 8 – Optional)
- Module 8: Component Damage and PCB Boards and Assemblies (Optional)
- Module 9: Discrete Wiring (Optional)
Module 1 introduces the student to the IPC-610F document and addresses IPC-published policies and procedures for CIS understanding of certification requirements.
This module addresses the IPC-610F foreword, scope, purpose and product classifications. It includes terms and definitions, inspection methodology, magnification and lighting, applicable documents, product handling and EOS/ESD requirements.
Module 3 focuses on physical damage to, contamination, ESD/EOS damage, and post solder handling of electronic assemblies. It addresses mechanical installation of heat sinks, threaded fasteners, connector and press fit pins, and wire bundle securing and routing.
Module 4 addresses acceptability requirements for all types of soldered connections (SMT, terminals, through-hole etc.). These requirements apply irrespective of the soldering method used. Accept/reject criteria for common tin/lead and lead-free soldering anomalies are specified, including exposed metal, cold solder, nonwetting/dewetting, excess solder, disturbed solder, fractured solder, and solder projections.
This module addresses terminal connections between wires and component leads, and terminals. It includes swaged hardware, wire insulation damage and clearance, wire/strand damage, tinning requirements, and stress relief. Terminals include turrets, bifurcated terminals, slotted terminals, pierced terminals, hooks, and gold cups.
Module 6 includes hardware, adhesive, forming, mounting termination and soldering criteria for through-hole components. It identifies lead installation, protrusion, and solder coverage for both supported and unsupported holes. It also addresses routing, staking, and attachment of jumper wires on both SMT and through-hole terminations. Minimum passing score on an open book exam is 70%.
Module 7 covers acceptability requirements for surface mount assemblies. This includes staking adhesive and its application. SMT connection criteria are specified for surface mounted chips, MELFs, castellated terminations, gull wing and J-leads, surface mount arrays, and jumper wires.
This module addresses component damage. Included are examples of loss of metallization on SMT chip resistors, and component damage to leaded/leadless devices, connectors, relays, transformers, connectors, and connector/press fit pins. It also includes laminate and conductor/land defect conditions, and laminate marking, cleanliness, and coating variations.
Module 9 specifies requirements for Solderless Wrap. It includes criteria for number of turns and turn spacing, wire dress/slack, and wire dress strain/stress relief.
J-STD-001F/ J-STD-001FS CIS Certification
Revision F to J-STD-001 is also modularized to provide company flexibility in training CIS candidates. Topics include electronic assembly definitions, materials and equipment, hand soldering and assembly of through-hole and SMT assemblies, wires and terminals.
Module 1 is a prerequisite to remaining modules. Modules 2 through 5 are optional and may be selected by the client for inclusion in the course. Each is certified separately. An open book exam is included for each module. A passing score of 70 percent is required for each. Students who successfully complete the course will receive an IPC-J-STD-001 CIS Certificate of Training indicating each module successfully completed. This certification is valid for 24 months. Recertification includes review of the J-STD-001 document, written tests, and demonstration of soldering proficiency. To maximize student learning we limit skills training classes to 10 students.
Content of each module is summarized as follows:
- Module 1: J-STD-001 Overview (Mandatory)
- Module 2: Wires and Terminals (Optional)
- Module 3: Through-Hole Technology (Optional)
- Module 4: Surface Mount Technology (Optional)
- Module 5: Inspection Methodology (Optional)
- Module 6: J-001FS Space Addendum (Optional)
Module 1 includes an introduction to the IPC Policies and Procedures, the J-001F Standard, and outlines content of additional modules. Elements include Instructor lecture, material review, and open book written exam.
Module 2 defines requirements for assembly of wires and terminal connections. It consists of Instructor lecture and Instructor demonstration of wire tinning and wire soldering to J-hook, turret, pierced, bifurcated, and cup terminals. Students practice each of these assembly techniques to demonstrate soldering proficiency in soldering terminal connections. An open-book exam is also included.
This module addresses assembly requirements for Through-Hole terminations. It includes Instructor lecture, review of related J-STD topics, and instructor demonstration of Through-Hole component preparation and soldering to a PCB. Students practice each of these soldering techniques and demonstrate soldering proficiency in soldering several types of Through-Hole components onto a PCB.
This module addresses assembly requirements for Surface Mount terminations. It includes Instructor lecture, review of related J-STD topics, and instructor demonstration of SMT component preparation and soldering to a PCB. Students practice each of these assembly techniques to demonstrate soldering proficiency in soldering several types of SMT components onto a PCB.
Module 5 introduces requirements for Inspection Methodology for soldered assemblies. Topics also provide an introduction to Process Control. It includes Instructor lecture, review of inspection-related topics, and an inspection skills lab. Each student inspects soldered assemblies with known defects and documents these inspection results.
Module 6, Space Applications Electronic Hardware Addendum to J-001F, is a 1-day course that identifies requirements to be used in addition to, or in lieu of, those published in J-001F. Its goal is to ensure reliability of electronic assemblies when exposed to the vibration and thermal environments getting to and operating in space.
IPC-7711/7721B CIS Certification
Revision B to IPC-7711/7721 is also modularized to provide companies flexibility in training CIS candidates. IPC addresses this in three (3) Parts:
- Part 1: Common Procedures (Mandatory)
- Part 2: Rework (IPC-7711B)
- Part 3: Modification and Repair (IPC-7721B)
Part 1 is a prerequisite for both Part 2 “Rework” and Part 3 “Modification and Repair.” This mandatory module presents the scope, purpose, background and controls for IPC-7711 and IPC-7721. It addresses IPC Policies and Procedures, process goals and guidelines associated with rework/repair of surface mount and through-hole components, PCB handling, EOS/ESD protection, cleaning, and preheating procedures. Before proceeding to optional modules, the CIS candidate must pass a 20-question open book exam with a score of 70 percent or higher.
Module 2: Wire Splicing (Optional)
Module 2 includes lecture, Instructor demonstration and CIS demonstration of proficiency in performing wire attachment to solder cups, pierced terminals, turret terminals, and wire hooks. Exercises include stripping, tinning and soldering of varying sized wires.
Module 3: Through-Hole Components (Optional)
Module 3 includes lecture, Instructor demonstration and CIS demonstration of proficiency in performing through-hole component removal, land preparation, and component installation in accordance with IPC-7711. Through-hole component exercises include axial resistors, diodes, radial capacitors, transistors, and DIPS.
Module 4: Chip and MELF Components (Optional)
This module includes lecture, Instructor demonstration, and CIS demonstration of proficiency in removal, land preparation, and installation of SMT chip caps, resistors, and MELFs in accordance with IPC-7711.
Module 5: Gull Wing Components (Optional)
Module 5 includes lecture, Instructor demonstration and CIS of proficiency in removing SOT, SOIC and QFP gull wing components, land preparation, and component installation.
Module 6: J Lead Components (Optional)
Includes lecture, Instructor demonstration and CIS demonstration of proficiency in removing J-lead components, land preparation, and component installation.
Module 7: PCB Circuit Repair
This module includes lecture, Instructor demonstration, and CIS demonstration of proficiency in jumper wire installation, PTH repair (no inner layers), SMT land repair, and conductor repair.
Module 8: Laminate Repair
Module 8 includes lecture, Instructor demonstration, and CIS demonstration of proficiency in repairing burned laminate by excavation, epoxy fill and re-surface.
Module 9: Conformal Coating
Includes lecture on 5 types of conformal coatings, their properties, and identification.
Each module is certified separately. Both tin-lead and lead-free solder are included in class discussion and soldering exercises. Students who successfully complete the course will receive an IPC-7711/7721 Certificate of Training, valid for 24 months, identifying each module successfully completed. Recertification includes review of the IPC-7711/7721 standard, written tests, and demonstration of soldering proficiency.
IPC-620B CIS Certification
IPC/WHMA-A-620B is a compendium of requirements for assembly of cable and harness assemblies. This 4-day lecture certification course provides a review of requirements for assembly of Class 1, 2, and 3 products. It is modularized to provide flexibility in user requirements. Review questions are included for each module.
Upon completing the course, the CIS receives an IPC-620B certificate identifying each module successfully completed. This certificate is valid for 24 months. Recertification includes review of the IPC-620B document and written exams.
- Module 1: Module 1 (Mandatory)
- Module 2: Crimp Terminations/Insulation Displacement Connections
- Module 3: Soldered Terminations
- Module 4: Connectorization, Over-Molding /Potting
- Module 5: Splices
- Module 6: Marking/Labeling, Securing, Harness/Cable Electrical Shielding, Protective Coverings, and Finished Assembly Installation
- Module 7: Coaxial and Biaxial Cable Assemblies
- Module 8: Solderless Wrap
Module 1 introduces the IPC Policies and Procedures, and addresses topics within the IPC-620B. These include the Foreword, Applicable Documents, Preparation and Measuring of Cable and Testing.