IPC-J-001H - Joint Industry Standard

As the IPC-610H focuses on assembly and inspection of electronic assemblies, J-001H focuses on the material, process requirements and acceptability requirements for manufacture of soldered electrical and electronic assemblies.

Module 1 is a prerequisite to remaining modules. Modules 2 through 6 are optional. An open book exam is included for each module. A passing score of 70 percent is required for each.

The course includes:

Module 1 General (Mandatory)
- Section 2 Applicable Documents
- Section 3 Materials, Components and Equipment Requirements
- Section 4 Through-Hole
- Section 8 Cleaning and Residue Requirements
- Section 12 Rework and Repair

Module 2 - Wireless Terminals
-Section 5 Wires and Terminal Connections

Module 3 - PCB, Coating, Encapsulation, and Staking
- Section 9 Printed Board Requirements
- Section 10 Coating, Encapsulation, and Staking
- Section 11 Witness Stripe

Module 4 - Through Hole (Requires M3)
- Section 6 (including PTH jumper wires)

Module 5 - Surface Mount (Requires M3)
- Section 7 (including SMT jumper wires)

Module 6 - Inspection (Requires M2, M3, M4, M5)